
Bergquist Company TGP EMI1000 Conformable EMI Absorbing GAP PAD®
Bergquist Company TGP EMI1000 Conformable EMI Absorbing GAP PAD® offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. The GAP PAD EMI 1.0 provides EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in higher thermal performance than harder materials with a similar performance rating. GAP PAD EMI 1.0 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required. Bergquist Company TGP EMI1000 GAP PAD comes with a protective liner on the material's tacky side.Features
- Thermal Conductivity: 1.0 W/m-K
- Electromagnetic Interference (EMI) absorbing
- Highly conformable, low hardness
- Fiberglass reinforced for puncture, shear and tear resistance
- Electrically isolating
Applications
- Consumer electronics
- ASICs and DSPs
- Telecommunications
- PC applications
Additional Resources
Published: 2015-08-13
| Updated: 2022-03-11