All Results (704)

Computer-On-Modules - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Computer-On-Modules - COM QSEVEN INTEL ATOM E3845 BAY TRAIL

Computer-On-Modules - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.

Development Boards & Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

Computer-On-Modules - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

Heat Sinks Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

Heat Sinks Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded.

CPU & Chip Coolers Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread

Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm

CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.